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PROJETS EUROPEENS
H2020 ECSEL
Embedded storage elements on next MCU generation ready for AI on the edge
Partenaires:
STMICROELECTRONICS (CROLLES 2) SAS
CEA
IMEC
CSEM
REEXEN
IMA
UTIA
FhG-IPMS
XFAB
TU Da
H2020 ECSEL
Metrology advances for digitized electronic components and systems (ECS) industry 4.0
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COLLABORATIONS INTERNATIONALES
Scientific expertise on Area Selective Deposition (ASD) by surface area deactivation thanks to the use of in situ diagnostics connected to PEALD tools
Partenaires:
TOKYO ELECTRON LIMITED (TEL), CEA GRENOBLE